Tribology of Abrasive Machining Processes
Ioan D. Marinescu et al
650 pages, © 2004 Noyes
Hardcover
$160 plus shipping (may change without notice)
Detailed Table of Contents --- Also: Commentary in special issue of the Abrasive User's News Fax
AUDIENCE
Machining process engineers, technicians, researchers and students.
FEATURES
Tribology principles for the most commonly used abrasive processes demonstrating potential improvements and solutions to common problems
Compilation of Kinematics for grinding previously widely dispersed.
Heat transfer principles for process effects on surface quality.
New information on effective fluid delivery.
Deformation processes using molecular dynamics simulation.
A wide variety of abrasive materials: sol gel grain, cubic boron nitride and diamonds.
DESCRIPTION
Improvements such as the use of high wheel speeds and advances in nanotechnology indicate that abrasive machining will become increasingly important in the future. This book is a fundamental rethinking of elements of abrasive machining in terms of tribology -- the interdiscplinary study of the interaction of surfaces. To the authors, tribology offers a better way to understand newer processes such as chemical mechanical polishing (CMP) and silicon wafer dicing. They also say that tribological principles are necessary to discover methods that improve accuracy, production rate, and surface quality for products that range from ball bearings to contact lens to semiconductors.
TABLE OF CONTENTS
Introduction to Abrasive Processes
Tribosystems of Abrasive Machining Processes
Kinematic Models of Abrasive Contacts
Contact Mechanics
Forces, Friction, and Energy
Thermal Design of Processes
Molecular Dynamics for Abrasive Process Simulation
Fluid Delivery
Electrolytic In-Process Dressing (ELID) Grinding and Polishing
Grinding Wheel and Abrasive Topography
Abrasives and Abrasive Tools
Conditioning of Abrasive Wheels
Loose Abrasive Processes
Process Fluids for Abrasive Machining
Tribology of Abrasive Machining
Processed Materials
ABOUT THE AUTHORS
Ioan D. Marinescu is Professor and Director of the Precision Micro-Machining Center at The University of Toledo, Toledo, Ohio. He is a coauthor of the Handbook of Ceramic Grinding and Polishing and known for presentations at various conferences worldwide.
W. Brian Rowe is a research and consulting engineer and past Professor and Director of Advanced Manufacturing Technology and Tribology Research Laboratory (AMTTREL) at Liverpool John Moores University in the UK. A recipient of prizes from The Institution of Mechanical Engineers (IMECHE), Dr. Rowe has four decades of experience in academia and industry concerned with machine tools, grinding processes, and tribology. Accomplishments include over 250 published papers, several books, international visiting professorships, and international consulting in industry.
Boris Dimitrov is a consultant and a former senior scientist at both the Institute for Applied Mechanics and the Institute for Precision Mechanics in Bucharest Romania. His four-decade career in tribology and machining research includes work in academic and industry capacities, receiving five patents, authoring 128 publications that include three books.
Ichiro Inasaki is Professor of Mechanical Engineering at Keio University, Yokohama, Japan. Coauthor of the Handbook of Ceramic Grinding and Polishing, he has won awards from the Mechanical Engineers, Grinding Engineers, and Precision Engineers Societies of Japan, and ten awards from the Japan Machine Tool Engineering Foundation. In 1998, he was a visiting professor at the University of California, Berkeley, United States
TRIBOLOGY First publicized in 1966, tribology is a multidisciplinary science of the friction, wear, and lubrication of interacting surfaces.
Though originally focused on lublicants, tribology applies knowledge from chemistry, physics, mechanics, material science, and metrology to surface characteristics of machined components for aerospace, automotive, optical, machinery&tools, microelectronics, military, and metallurgy industries.
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rev 11/23/04
©2004