Advances in Abrasive Technology XI ISBN 978-0-87849-364-7

ISAAT 2008
Peer-reviewed papers from the 11th International Symposium on Advances in Abrasive Technology, Sept. 30, 2008 - Oct. 3, 2008, Awaji Yumebutai International Conference Center, Awaji City, Hyogo Japan 544 pages, illus,
Key Engineering Materials, Volumes 389 - 390
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TABLE OF CONTENTS | PREFACE NOTES | SUBJECT INDEX

This book is a collection of peer-reviewed papers exploring a better understanding of abrasives technology and its application in precision manufacturing. The book is the latest in a series dating back to 1997 under such names as "Advances in Abrasive Technology" and "Precision Grinding and Abrasive Technology" produced at meetings sponsored by the International Committee for Abrasive Technology (ICAT) and known as International Symposium on Advances in Abrasives Technology (ISAAT).
Here is a resource for researchers in the abrasive technology as well as practicing engineers in precision manufacturing.

TABLE OF CONTENTS Following is a list of the papers in this volume. Abstracts can be download and papers are available through AES as separates.
Prediction of Grinding Force Distribution in Wheel and Workpiece Contact Zone Z. Shi, Madhusudhan Srinivasaraghavan, Helmi Attia	p1 abstract
Study on the Subsurface Damage of Single Crystal MgO Substrates Zhi Gang Dong, Ren Ke Kang, Zhen Yuan Jia	p7 abstract
Study on Improvement of Material Removal Rate in Chemo-Mechanical Grinding (CMG) of Si Wafer J. Sasaki, T. Tsuruga, B.H. Soltani, T. Mitsuta, Y.B. Tian, Jun Shimizu, Li Bo Zhou, Hiroshi Eda, Y. Tashiro, Hisao Iwase, Sumio Kamiya	p13 abstract
Comparative Study on the Materials Removal Mechanism of Ceramics and Steels Jian Qiang Guo, Hitoshi Ohmori, Kazutoshi Katahira, Yoshihiro Uehara	p18 abstract
Grinding of Carbon/Epoxy Composites Using Electroplated CBN Wheel with Controlled Abrasive Clusters H.P. Yuan, Hang Gao, Yong Jie Bao, Yong Bo Wu	p24 abstract
Experimental Analysis of Elastic and Plastic Behavior in Ductile-Regime Machining of Glass Quartz Utilizing a Diamond Tool Junichi Tamaki, Akihiko Kubo, Ji Wang Yan	p30 abstract
Characteristics of the Wheel Surface Topography in Ultra-precision Grinding of Silicon Wafers Feng Wei Huo, Dong Ming Guo, Ren Ke Kang, Zhu Ji Jin	p36 abstract
Fractal Analysis of Self-Sharpening Phenomenon in cBN Grinding Yoshio Ichida, Ryunosuke Sato, Masakazu Fujimoto, Nabil Ben Fredj	p42 abstract
Observation of Abrasive Grains Behavior in Contact Area of Grinding Wheel and Comparison with Grinding Wheel Model Taisei Yamada, Hwa Soo Lee	p48 abstract
Thermal Damage of Micro Diameter Hole Drilled by Super-High-Speed Spindle in PWB Hiroshi Nojiri, Toshiki Hirogaki, Eiichi Aoyama, Keiji Ogawa, Tsuyoshi Otsuka	p55 abstract
Experimental Trial of Fullerene Wheel Fabrication Takeshi Tanaka	p61 abstract
Research of Ultrahigh Speed Grinding Spindle System Based on Squeeze Film Damping Technology Tian Biao Yu, Ya Dong Gong, Hu Li, Jian Yu Yang, Wan Shan Wang	p67 abstract
Development of CNT-Coated Diamond Grains Using Self-Assembly Techniques for Improving Electroplated Diamond Tools Tsunehisa Suzuki, Toshiaki Mitsui, Tomoki Fujino, Mutsuto Kato, Yasufumi Satake, Hiroshi Saito, Seiya Kobayashi	p72 abstract
Proposal of Pulverization Method Based on Grinding Process in Order to Recycle FRP Waste Haruhisa Sakamoto, Shogo Nabata, Shinji Shimizu	p77 abstract
Error Analysis and Robust Position Measurement for Vertex of a Small Polyhedron Takashi Harada	p83 abstract
Grinding Burn and Chatter Classification Using Genetic Programming Xun Chen, James Griffin	p90 abstract
Control of Nano-Topography on an Axisymmetric Ground Surface Nobuhito Yoshihara, Ji Wang Yan, Tsunemoto Kuriyagawa	p96 abstract
Measurement of High-NA Axisymmetric Aspherical Surface with Continuous Interference Method Y. Nagaike, Tsunemoto Kuriyagawa, Wei Gao, Ji Wang Yan, Nobuhito Yoshihara	p102 abstract
Observation of Grinding Wheel Wear Patterns by Means of a 3-Dimensional Digital Measuring Method Hwa Soo Lee, Takazo Yamada, Naoyuki Ishida	p108 abstract
Numerical Analysis for Thermal Deformation of Workpiece in Cylindrical Plunge Grinding Hiroyuki Hasegawa, Suritalatu, Moriaki Sakakura, Shinya Tsukamoto	p114 abstract
Fuzzy Rules for Surface Roughness of Ground Steels Y.M. Ali, Liang Chi Zhang	p120 abstract
Geometrical Simulation of Surface Finish Improvement in Helical Scan Grinding Method by Means of 3D-CAD Model Kiyoshi Suzuki, Yoichi Shiraishi, Shinichi Ninomiya, Manabu Iwai, Tetsutaro Uematsu	p126 abstract
Planing of Cobalt-Free Tungsten Carbide Using a Diamond Tool -Cutting Temperature and Tool Wear- Akinori Yui, Hiroshi Matsuoka, Takayuki Kitajima, Shigeki Okuyama	p132 abstract
Cutting Temperature Measurement in Turning with Actively Driven Rotary Tool Suryadiwansa Harun, Toshiro Shibasaka, Toshimichi Moriwaki	p138 abstract
Coolant Effects on Tool Wear in Machining Single-Crystal Silicon with Diamond Tools Tsutomu Ohta, Ji Wang Yan, Sunao Kodera, Shuuma Yajima, Naoyuki Horikawa, Youichi Takahashi, Tsunemoto Kuriyagawa	p144 abstract
Machinability Investigation of Reaction-Bonded Silicon Carbide by Single-Point Diamond Turning Zhi Yu Zhang, Ji Wang Yan, Tsunemoto Kuriyagawa	p151 abstract
High Speed Cutting of Titanium Alloy with PCD Tools Michiko Ota, Junya Okida, Takashi Harada, Naohiro Toda, Hitoshi Sumiya	p157 abstract
Development of DLC Coated Tool for Cutting of Aluminum Alloy -Influence of Deposition Condition on Cutting Characteristics Kazushi Minaki, Koichi Kitajima, Yu Nakahira, Masami Ohnishi, Takashi Sugimoto, Shun Kaminomura	p163 abstract
Observations on Orthogonal Cutting Processes - Effect of Friction between Tool and Work Material - Junya Okida, Hideki Moriguchi, Takao Nishioka, Hiromi Yoshimura	p169 abstract
Development of A New Cutting Fluid Supply System for Near Dry Machining Process Motoki Yamashita, Yasuhiro Kakinuma, Tojiro Aoyama, Mitsuho Aoki	p169 abstract
Study on the Surface Quality of Optical Glass in Ultrasonic-Magnetorheological Compound Finishing Fei Hu Zhang, Hui Jun Wang, Jian Feng Liu, Dian Rong Luan, Yong Zhang	p181 abstract
Quartz Wafer Machining Using MCF (Magnetic Compound Fluid) Polishing Liquid Frozen with Liquid Nitrogen Yong Bo Wu, Kunio Shimada	p187 abstract
Simulation and Experimental Analysis of Electromagnetic Inductor for Magnetic Abrasive Finishing Qiu Sheng Yan, T.X. Qiu, Wei Qiang Gao, L. Meng	p193 abstract
The Research of NC Magnetic Abrasive Finishing for Mould Parting Surface Wei Qiang Gao, L. Meng, Qiu Sheng Yan, J.H. Song, T.X. Qiu	p199 abstract
Computer Aided Design and Grinding for Helical Drill Points P. Zou, Xin You Li, Y. Tang, X.L. Yang	p205 abstract
A New CBN Crystal for Improved Grinding Performance in Vitrified Bonds Sridhar Kompella, Kai Zhang, Rajeev Pakalapati	p211
Study on Two Kinds of Grinding Wheels for Dynamic Friction Polishing of CVD Diamond Film Zhu Ji Jin, Ze Wei Yuan, Ren Ke Kang, B.X. Dong	p217 abstract
Fundamental Study on the Precision Abrasive Machining Using a Cavitation in Reversing Suction Flow Kazuhito Ohashi, Rong Jun Wang, Hiroyuki Hasegawa, Shinya Tsukamoto	p223 abstract
Researches on Effect of Impact Micro-Damages in Contact Layer on Machinability in Quick-Point Grinding Shi Chao Xiu, Suo Xian Yuan, Guang Qi Cai	p229 abstract
Study on Abrasive Geometry of Quick-Point Grinding Suo Xian Yuan, Dong Na Xie, Ya Dong Gong	p235 abstract
Model-Based Compensation of Geometry-Errors when Grinding Material Compounds Berend Denkena, Niklas Kramer	p240 abstract
A New Type of Drill Grinder Based on the Special Universal Joint P. Zou, H.R. Qiu, Shan Min Gao, Ming Hu	p246 abstract
Simulation of Dynamic Performance for Hydro-Hybrid Spindle-Bearing System of Superhigh Speed Grinder Wan Shan Wang, L.D. Zhu, Tian Biao Yu, Jia Shun Shi, He Li	p252 abstract
Model Based Characterization of the Grinding Wheel Effective Topography Niklas Kramer, C. Wangenheim	p258 abstract
Fabrication of High-Aspect Ratio Micro Holes on Hard Brittle Materials -Study on Electrorheological Fluid-Assisted Micro Ultrasonic Machining- T. Tateishi, Nobuhito Yoshihara, Ji Wang Yan, Tsunemoto Kuriyagawa	p264 abstract
Grinding of Soft Steel with Assistance of Ultrasonic Vibrations Taghi Tawakoli, Bahman Azarhoushang, Mohammad Rabiey	p271 abstract
Ultrasonic Vibration-Assisted Cutting of Titanium Alloy Shigeomi Koshimizu	p277 abstract
Effects of Grain Size and Concentration of Grinding Wheel in Ultrasonically Assisted Grinding M. Nomura, Yong Bo Wu, Tsunemoto Kuriyagawa, T. Kawashima, T. Shibata	p283 abstract
Electrochemical Finishing with an Electrode Vibrated with Biaxial Ultrasonic Transducer Manabu Iwai, Wen Qiu Wei, Shinichi Ninomiya, Sadao Sano, Tetsutaro Uematsu, Kiyoshi Suzuki	p289 abstract
Synchronous Finish Processes Using Grinding and Ultrasonic Electrochemical Finishing on Hole-Wall Surface Pai Shan Pa	p295 abstract
Development of a Three-Dimensional Tool Oscillation System for Finishing Metal Molds Masahiro Mizuno, Toshirou Iyama, Xu Zhang, Naohiro Nishikawa	p302 abstract
Engineering a Next Generation Water-Based Grinding Fluid Peter Hug, Andrew R. Nelson, Stuart C. Salmon	p308 abstract
Evaluation of Bearing Grinding Fluids Milton L. Hoff, Stuart C. Salmon	p314 abstract
The Correlation and Spectrum Research on Cylindrical Surface Lapping Machined with Abrasive Jet Finishing Restricted by Grinding Wheel Feng Liu, Ya Dong Gong, Y.Q. Shan, Guang Qi Cai	p320 abstract
Application of a Floating Nozzle to Grinding Process Using an Edge of Grinding Wheel Shinichi Ninomiya, Fan Qiang, Toshiharu Shimizu, Manabu Iwai, Tetsutaro Uematsu, Kiyoshi Suzuki	p326 abstract
A Study on Airflow Field of Super-High Speed Pectination Grinding Wheel Based on PIV Ya Dong Gong, Yan Cheng Zhang, Hu Li, Wan Shan Wang	p332 abstract
Actively Cooled and Activated Coolant for Grinding Brittle Materials Y. Gao, J. Xin, H. Lai	p338 abstract
Spatial Distribution of Cooling Mist for Precision Grinding Y. Gao, J. Xin, H. Lai	p344 abstract
A Truing Technique of Flattening Diamond Grains for Fabricating Microstructures with Fine Surfaces Takeshi Harada, Takuya Semba	p350 abstract
The Possibility of Dressless Restoration of Grindactivity in Dry Grinding of Carbon Kazuhito Ohashi, Y. Sumimoto, Y. Fujita, Hiroyuki Hasegawa, Shinya Tsukamoto	p356 abstract
Virtual Truing and Dressing of Grinding Wheel Zbigniew M. Bzymek, Glenn M. Duzy, Richard B. Mindek	p362 abstract
Effects of Cutting Edge Truncation on Ultrasonically Assisted Grinding Keisuke Hara, Hiromi Isobe, Akira Kyusojin	p368 abstract
A Preliminary Study of the Erosion Process in Micro-Machining of Glasses with a Low Pressure Slurry Jet Thai Nguyen, King Pang, Jun Wang	p375 abstract
Hole Machining of Glass by Micro Abrasive Suspension Jets Cheng Yong Wang, M.D. Chen, P.X. Yang, Jing Ming Fan	p381 abstract
Simulation and Analysis of Abrasive Jet Machining with Wheel Restriction in Grinding Wan Shan Wang, L.D. Zhu, Tian Biao Yu, Jian Yu Yang, L. Tang	p387 abstract
Profit Optimization of Abrasive Blasting Systems Vu Ngoc Pi	p392 abstract
Design of Double Nozzle Type Powder Jet Device Optimized for PJD T oshihiko Shibuya, Mohammad Saeed Sepasy, Koichi Mizutani, Nobuhito Yoshihara, Ji Wang Yan, Tsunemoto Kuriyagawa	p398 abstract
Thermal Deformation of Base Sheet and Local Deformation Around Laser Cutting Edge Masayuki Nunobiki, Koichi Okuda, Shogo Morino	p404 abstract
Grinding Combination of Electrochemical Smoothing On SKH 51 Surface Pai Shan Pa	p410 abstract
Fundamental Study on Influence of Surface Topography on Photocatalytic Reaction Keisuke Azusawa, Yuta Ishii, Jun Shimizu, Li Bo Zhou, Hiroshi Eda	p417 abstract
Fundamental Research on Generation of Nanostructure by Means of Local Anodic Oxidation Yumetaka Suehisa, Toshiaki Aoki, Jun Shimizu, Li Bo Zhou, Hiroshi Eda	p424 abstract
An Investigation into Surface Roughness of EDM Using Soft Particles Suspension in Silicone Oil Y.Y. Tsai, Chi Kuang Chang	p430 abstract
Analysis on the Fracture Failure of Brazed Diamonds in Wire Sawing Guo Qin Huang, Hui Huang, Xi Peng Xu	p436 abstract
Effects of Thermal Deformation of Multi-Wire Saw�s Wire Guides and Ingot on Slicing Accuracy Yoshinori Abe, Ken-Ichi Ishikawa, Hitoshi Suwabe	p442 abstract
Study on Glass Strength at High Speed Edge Rounding for LCD Nobuyoshi Suzuki, Tatsunoli Halai	p448 abstract
The Deformation Mechanism at Pop-In: Monocrystalline Silicon under Nanoindentation with a Berkovich Indenter Li Chang, Liang Chi Zhang	p453 abstract
Material Removal Mechanism of Chemo-Mechanical Grinding (CMG) of Si Wafer by Using Soft Abrasive Grinding Wheel (SAGW) Dong Ming Guo, Y.B. Tian, Ren Ke Kang, Li Bo Zhou, M.K. Lei	p459 abstract
Subsurface Structures of Monocrystalline Silicon Generated by Nanogrinding Han Huang, Y.Q. Wu, Y. Wang, Jin Zou, Li Bo Zhou	p465 abstract
Complete Recovery of Subsurface Structures of Machining-Damaged Single Crystalline Silicon by Nd:YAG Laser Irradiation Ji Wang Yan, Tooru Asami, Tsunemoto Kuriyagawa	p469 abstract
Study on Adhesion Removal Model in CMP SiO2 ILD Dong Ming Guo, Rui Hong Liu, Ren Ke Kang, Zhu Ji Jin	p475 abstract
Study on the CMP Pad Life with its Mechanical Properties Pei Lum Tso, Zhe Hao Huang, Sheng Wei Chou, Cheng Yi Shih	p481 abstract
Polishing Characteristics on Silicon Wafer Using Fixed Nano-Sized Abrasive Pad Pei Lum Tso, Cheng Yi Shih	p487 abstract
A Study on Statistical Analysis of Si-Wafer Polishing Process for the Optimum Polishing Condition Sung Chul Hwang, Jong Koo Won, Jung Taik Lee, Eun Sang Lee	p493 abstract
Effect of Conditioning Parameters on Surface Non-Uniformity of Polishing Pad in Chemical Mechanical Planarization N. Qin, Dong Ming Guo, Ren Ke Kang, Feng Wei Huo	p498 abstract
Achieving a Damage-Free Polishing of Mono-Crystalline Silicon A.Q. Biddut, Liang Chi Zhang, Y.M. Ali, Zong Wen Liu	p504 abstract
Effect of Polishing Time and Pressure on Polishing Pad Performance A.Q. Biddut, Liang Chi Zhang, Y.M. Ali	p510 abstract
Polishing Characteristics of CMP for Oxygen Free Copper with Manganese Oxide Abrasives Ryunosuke Sato, Yoshio Ichida, Yoshitaka Morimoto, Kenji Shimizu	p515 abstract
Scale Effect of Nano-Indentation of Silicon � A Molecular Dynamics Investigation Kausala Mylvaganam, Liang Chi Zhang	p521 abstract

SUBJECT INDEX


3-D Digital Measuring Method  108
 3D-CAD Model   126 
 A
 Abbott-Firestone-Curve  258
 Abrasive  430 , 510
 Abrasive Blasting  392
 Abrasive Cleaning 392
 Abrasive Cluster  24
 Abrasive Geometry  235
 Abrasive Grain   48,  83, 264,   356
 Abrasive Grain Distribution   258
 Abrasive Grain Shape   258
 Abrasive Jet   375
 Abrasive Jet Finishing (AJF)   320
 Abrasive Jet Machining   387
 Abrasive Machining   223
 Activated Coolant   338,   344
 Active Cooling   338,  344
 Active Sulphur   308
 Adaptive Processes   240
 Adhesion    169
 Adhesion Removal   475
 Adhesive Tape   356
 Air   132
 Air Bonds   332
 Airflow Field   332
 Aluminium    163
 Angular Grinding   326
 Argon Gas    132
 Aspheric Surface    102
 Attritious Wear   42
 Auto Correlation Function   320
B
 B-RING   55
 Bearing Industry   314
 Boolean Operation    126
 Box-Behnken Method   493
 Brazing   436
 Brittle Material   338
 Built-Up Edge    169
C
 C/E Composite   24
 Carbon Chips   356
 Carbon Nanotubes (CNT)   72
 Cavitation   223
 Cavitation Impact   223
 CBN   211
 CBN Grinding Wheel   42
 Centerless Grinding   314
 Ceramic    18
 Chemical Mechanical Polishing   475,
  481,  515
 Chemo-Mechanical Grinding    13
 Classification   90
 CMG   459
 Coated Tool    163
 Combined Processes   410
 Conditioner   498
 Contact Area   48
 Contact Width   424
 Continuous Interference Method    102
 Control    120
 Coolant    144 ,   326
 Cost of Consumable   481
 Creep Feed   211
 Creep Feed Grinding   I
 Cross-Correlation Functions   320
 Cross-Section   7
 Cutting    132 ,   157 ,   163
 Cutting Edge Truncation   368
 Cutting Speed   277
 Cutting Temperature   55,   138
 CVD Diamond   217
 Cylindrical Plunge Grinding    114
 D
 Deformation Mechanism   404
 Design of Experiment (DOE)    13
 Detergency   308
 Diamond Electroplated Tool   368
 Diamond Retention   436
 Diamond Tool   30,   132
 Diamond Turning    144,   151
 Diamond Wheel   448
 Dislocation   7
 Distance Between Terminals   424
 DLC    163
 Dressing   350
 Drill Grinding   205,246
 Drilling  55,  381
 Dry Grinding   356
 Ductile Brittle Transition    18
 Ductile Cutting    144
 Ductile Machining    151
 Ductile Regime Machining   30
 Dynamic Friction Polishing   217
 Dynamic Performance   252

 
 E
 Edge Rounding   448
 Effect of Fluid Concentration   308
 Elastic Deformation   30
 Electrochemical Finishing   295
 Electrochemical Machining   289
 Electrochemical Smoothing   410
 Electroformed Diamond Tool   350
 Electromagnetic Inductor    193
 Electroplated CBN Wheel   24
 Electroplated Diamond Tool   72
 Electrorheological Fluid   264
 ELID Grinding    18
 End Milling    163
 Engineering Optimization   55
 Environment    132,   175
 Erosion   375
 Error Analysis   83
 F
 Factorial Design    13
 Feed Angle    126
 Feed Rate   448
 Figure?8 Motion   302
 Film   417
 Final Polishing Processing   493
 Finish?Tool   410
 Finishing   289 ,   302
 Finite Difference Method (FDM)    114
 Finite Element Method (FEM)   252 ,   3
 Finite Element Simulation    193
 Fixed Abrasive Pad   487
 Flat Panel   448
 Floating Nozzle   326
 Force Distribution  I
 Fractal Dimension   42
 Fracture   436
 Friction    169
 FRP Waste   77
 Fullerene   61

 
G
 G Ratio   308
 Genetic Programming   90
 Grinding Wheel Model   48
 Glass   381
 Glass Quartz   30
 Glass Strength   448
 Glass Substrate   448
 Grain Cutting Edge   42
 Grain Protrusion Height   36
 Grain Retentivity   72
 Grinder   246
 Grinding   24 ,   36 ,   120, 211, 240, 271, 295 ,   338 ,  410
 Grinding Burn  
 Grinding Chatter  
 Grinding Fluid   314
 Grinding Force    1, 235, 271, 283
Grinding Heat    114
 Grinding Performance   326
 Grinding Power   308
 Grinding Process   77
 Grinding Wheel   48 ,   108, 217 ,   314 ,   356
 Grinding Wheel Restriction   387
 Grinding Wheel Spindle   67
 Grinding Wheel Topography   258
 H
 Hard-Brittle Materials   264
 Hard Particle   430
 Helical Drill Point   205
 Helical Scan Grinding    126
 High Aspect Ratio   264
 High Frequency Quartz Oscillator    187
 High?NA    102
 High Pressure Coolant    157
 High Speed Cutting    157
 High-Speed Spindle   55
 High Speed Video Camera   169
 Hole   295
 Hybrid Process   487
 Hydrophilicity   417,   1
 Image Processing    77 
 Impact Micro?Damages   229
 Inconel   211
 Indentation   521
 Infrared Lens    144
 Insulated Bipolar Transistor (IGBT)    13
 Interferometer    102
 Internal Grinding   283
 K
 Knowledge Engineering    120
 L
 Laser Cutting   404
 Loading   356
 Local Anodic Oxidation   424
 M
 M2   211
 Machinability    151
 Machine Tools   205
 Machining    120
 Magnetic Abrasive Finishing    193 ,   199
 Magnetic Compound Fluid (MCF)    187
 Magnetic Flux Density    193
 Manganese Oxide Abrasives   515
 Material Compound   240
 Material Removal    187
 Material Removal Mechanism    18
 Material Removal Rate    13, 289
 Mechanical Polishing   487
 Mechanical Property   453
 Mechanism   459
 Meshy Polishing Track    199
 Metal?Bonded Wheel  61
 Metal Mold   302
 Micro Abrasive Suspension Jet   381
 Micro-Grinding   350
 Micro Hole   264
 Micro-Hole Feature   375
 Micro-Machining   375
 Microcrack   7
 Microfracture   42
 Microjet   375
 Milling    175
 Mirror Surface Finishing   368
 Mist Particle Size Spatial Distribution   344
 Mn203   515
 Molecular Dynamics   521
 Mono?Crystalline Silicon   453
 Mould Parting Face    199
 MQL    175
 Multi?Wire Saw   442
 Multilayer Piezoelectric  Transformer (MPT)   302

N
 Nanogrinding   465
 Nanoindentation   30 ,  453
 Nanoindentation Hardness    163
 Nanoscratch   465
 Nanotopography   96 ,  442
 Nd:YAG Laser   469
 Nitrogen Gas    132
 Non-Uniformity   498
 0
 Observation    108
 Oil Mist    175
 Orthogonal Cutting Process    169
 Oxygen Free Copper   515

 P
 Pad Conditioning   481
 Parallel Mechanism   246
 Particle Image Velocimetry (PIV)   398
 Particle Image Velocity (PIV)   332
 Particle Velocity   398
 PCD    157
 Pectination Grinding Wheel   332
 Permanent Magnet Pole    199
 Phase Shifting Method    102
 Phase Transformation   469 ,   504
 Phase Transition   453
 Photocatalytic Reaction   417
 
Pile-Up Residual   30
 Planer    132
 Plasma Chemical Vapor Deposition    163
 Plastic Deformation   30 ,  404
 PMDEDM   430
 Polishing   61,   181,   187,  504,  510
 Polishing Pad   498
 Polycrystalline Diamond    157
 Polymer   430
 Powder   417
 Powder Jet Deposition   398
 Power Spectral Density (PSD)   320
 Precision Measurement    102
 Printed Wiring Board   55
 Profit Optimization   392
 Protrusion Pattern   424
 Pulverization Method   77

 

 Q
 Quartz Wafer    187
 Quick Point Grinding   229, 235

R
 Reaction Bonded Silicon Carbide    151
 Recycling   77
 Regression Analysis   493
 Removal Mechanism   465
 Removal Ratio   229
 Resin Bond   314
 Restriction Nozzle   223
 Robust Measurement   83
 Rotary Tool    138
 Rotation Direction   498
 Rotation Speed   498
 S
 SAGW   459
 Sand Blasting   392
 Sand Cleaning   392
 Scale Effect   521
 Scanning Probe Microscope   424
 Self Assembly   72
 Self-Sharpening   42
 Semi?Dry Cutting   277
 Shape from Focus   83
 Si Wafer   424 ,  493
 Silicon   465 ,   504 ,   510 ,   521
 Silicon Dioxide   475

 
 Silicon Wafer    13 ,   36 ,61 ,  442 ,  459
 Simulation    114, 205, 252 ,   387
 Single Crystal MgO   7
 Single Crystal Silicon    144 ,  469
 Single Point Fly Cutting   30
 Size Distribution   77
 Slicing   442
 Slip   7
 Slurry   475
 Soft Particles   430
 Speed Ratio   498
 Spindle Bearing System   252
 Squeeze Film Damper   67
 Squeeze Film Stiffness   67
 Static Effective Grain Density   36
 Strain Rate   229
 Subsurface Damage    465 ,  469
 Super High Speed Grinding   252 ,   332
 Superalloy   211
 Surface Area   417
 Surface Characteristic   375
 Surface Finish   223, 295 ,  410
 Surface Morphology   320
 Surface Quality    181
 Surface Roughness    126 ,   187 ,   193, 229,
 271, 277, 283, 289 ,   338 ,  417 ,  493
 Surface Tension   308
 Surface Topography   417
 Surfactant   308
 Suspension Ability   77
 Synchronous Process   295
 T
 Taguchi Method   344
 Tap Water   289
 TEM   504
 Temperature    132
 Thermal Deformation    114
 Thermal Stress   404
 Thickness   187
 Three Dimensional Tool
 Oscillation System   302
 Ti02   417
 Titan Alloy   277
 Titanium Alloy    157
 Tool Flank Wear   277
 Tool Wear   132,   144
 Tribology   120,   169
 Truing   350
 Tungsten Carbide   132
 Turning    138, 27
 U
 Ultra-Precision Grinding   96 ,  459
 Ultra-Precision Machining   181
 Ultra Violet Ray   417
 Ultrahigh Speed Grinding   67
 Ultrasonic   295
 Ultrasonic Assisted Grinding   271
 Ultrasonic Machining   264
 Ultrasonic-Magnetorheological  Compound Finishing    181
 Ultrasonic Vibration   283, 289
 Ultrasonic Vibration-Assisted Cutting   277
 Ultrasonically Assisted Grinding   368
 Universal Joint   246
 V
 V-Groove Grinding   326
 Vibration  96
 Virtual Dressing   362
 Virtual Grinding Trace    126
 Virtual Model of Grinding Wheel   362
 Virtual Truing   362
 Vitrified Bond   211 ,   314
 Voltage   424
 W
 Water-Based Grinding Fluid   308
 Water-Based Metalworking Fluids   314
 Water Jet   381
 Wavy Pattern   375
 Wear   108
 Wear Pattern   108
 Weibull Distribution   448
 Wettability   417
 Wheel Chatter   36
 Wheel Elastic Deformation   36
 Wheel Surface Replica   362
 Wheel Surface Topography   36
 Wire Sawing   436
 x
 XPS   459