TABLE OF CONTENTS
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Honors Lecture
- Modeling the related process of abrasion, weare and polishing by P Oxley
- Recent advances in ultraprecision surface finishing technologies in Japan by Yasunaga
Mechanisms of Material Removal and Related Problems
- Possible mechanism of brittle-ductile transition in material removal in micromachining of brittle materials by S Himada
- Subsurface structure change of silicon after ultraprecision grinding by I Zarudi and others
- Si-O-Si bonding configurations of damage layer formed after diamond grinding and chemomechanical polishing of wafers by Y Chang and others
- Phase transformation of silicon during nano-indentication by H Tanaka and LC Zhang
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INNOVATIVE WHEEL DESIGNS FOR FLUID DELIVERY FOR CERAMIC GRINDING - Page 87
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LAPPING FILMS AND FLUID ADDITIVES Page 62
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Polishing and Lapping
- Electrophoresis -polishing witha partitial electrode tool by K. Suzuki and others
- Precision optical polishing using pitch and teflon laps at CSIRP TIP: a review by A Leister
- Mechanisms of silicon polishing: chemical, mechanical, and electrical effects by Y Samitsu
- Mirror finishing of 6Al-4V Titanium alloy utilizing new lapping tape--application of polishing fluid by K Kitajima and others
- CMP characteristics and polishing machine in ILD planarization by J Watanabe and others
- Magnetic field assisted grinidng like polishing of hydropilic polymer materials by J. Sun and others
- Computer controlled lapping of granite plate by J Wang and others
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Grinding
- High efficiency grinding of difficult to machine materials
- Practical modeling of the surface integrity of ground components by L Zhange
- Development of sequential grinding polishing process applicable to large size wafer finishing by Yasungaga
- Control of grain depth of cuta in ductile mode grinding of brittle materials and practical application by A Kanai and others
- Elastic recovery of ground traces made by single grain grinding by M Yoshioka
- A study of grinding quantities using chip volume by P-L Tso and S-H Wo
- Precision grinding of aspheric surfaces-accuracy improving by on-machine measurement by H. Suzuki and others
- Simulation of cylindrical plunge grinding based on the behaviour of cutting edge wear by E-S Lee and others
- Abrasive Technology - next generation processes require next generation machine tool technolgy by S Salmon
- A study on the realtion between outgassing and characteristcs of ground surfaces by J Shibata
- Cylindrical mirror grinding with extremely fine grit wheels by N Wajima and others
- Performance of grinding fluids for high speed grinding using CBN wheels by T Imai and others
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SPECIAL WHEELS DESIGNS FOR CERAMICS- Page 105 |
Grinding Wheels
- Grinding characteristics of wheels with new CBN grits ABN800 by K Suzuki and other
- On-machine electrodischarge truing/dressing.
- Quantified wear mechanisms of diamond wheels in creep feed grinding of ceramic materials by T Liao and others
- On-machine monitoring of dulling behaviour of wheel working surface by S Shimizu and H Sakamoto
- Research and development of SF dressing method for superabrasive grinding wheels - influences of kind of dressing wheels and flow rate of dressing fluid by S Tooe and others
- Characterization of contacting portion of grinding wheel surfaces by W Scott
- Fuzzy modeling of wear of grinding wheels by Z Zhang and L Zhang
Other Techniques
- Newly developed micro-processing and measuring system unifying friction force microscope by K Ashida and others
- Improving surface finish generated by the abrasive waterjet process by E Siores and others
- Effect of abrasive grain size on surface finish and abrasion in abrasive flow finishing of aluminum by U Yamaguchi and N Takakura
- Development of automatic measuring system on cutting tool geometry by H Aoyama and others
- Effect of installation of surface grinding machine on wheel unbalance vibrations by K Yoshida and others
- Robotics deburring of GFRP parts using belt sander - improvement in the flexibility by fuzzy control. Y Nasu and others
- Design and manufacturing of indexable insert grinding machine: and experimental evaluation by A Joshi and others
- Nonaxisymmetric aspheric grinding technique for ceramic mirrors by T Kuriyagawa and others
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