| Grinding Fluid Applications |
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Analysis of Fluid Flow in the Grinding Using the Laser Doppler Anemometry (LDA) Technique
H. Wu, B. Lin, Y.D. Tridimas, and M.N. Morgan
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Application of Flexible Fluid Supplying Sheet to High Speed Grinding
Toshiharu Shimizu, Manabu Iwai, Shinichi Ninomiya, Tetsutaro Uematsu, and Kiyoshi Suzuki |
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Grinding Fluid Alternatives |
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An Innovative Concept for Dry Grinding with Resin and Vitrified Bond CBN Wheel
Taghi Tawakoli and Mohammad Rabiey |
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Effect of Micro Bubble Coolant on Grinding with CBN Wheel
Kiyoshi Suzuki, Manabu Iwai, Shinichi Ninomiya, Toshiharu Shimizu, Akitake Hashidate,
Hirohisa Arai, and Tetsutaro Uematsu |
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High-Speed Grinding with Electroplated cBN Wheels Using Oil vs. Waterbased Fluids
Jean M. Dasch, James B. D'Arcy, Hap Hanna, Yaming Yin, Richard Kopple, and Stuart Salmon |
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Water Soluble Oil Versus Straight Machining Oil for Production ID Grinding with Vitrified CBN
Mark Herrema |
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Processing Semiconductor Materials
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The Effect of Temperature Characteristic on Si-Wafer Polishing for a Variable Machining Condition
Jong-Koo Won, Jung-Taik Lee, and Eun-Sang Lee |
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The Evaluation of Pressure Characteristics in Wafer Polishing with Variable Working Speed
Eun-Sang Lee, Jung-Taik Lee, and Jong-Koo Won |
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Study on Thinning Process of Large Size Si Wafer
T. Tsuruga, B. Soltani.H, J. Sasaki, T. Mitsuta, J. Shimizu, L. Zhou, and H. Eda |
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Development of On-Machine 3D Measuring System for Large Size Si Wafer Thinning Process
T. Mitsuta, B.S. Hosseini, T. Tsuruga, J. Sasaki, L. Zhou, J. Shimizu, and H. Eda |
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Estimation of Total Thickness Variation for Wafer Thinning by Diamond Grinding Process
Chao-Chang A. Chen and Li-Sheng Hsu |
| Effect of TiO2 and CeO2 Particles on SiC Semiconductor Surfaces Polished Under
Ultraviolet-Ray Irradiation
Junji Watanabe, Seok-Hyoung Hong, Keishi Yamaguchi, Mutsumi Touge, and Noritaka Kuroda |
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Machining Titanium |
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Rotary Ultrasonic of Titanium Alloy: Experimental Investigations
P.F. Zhang, Z.J. Pei, and C. Treadwell |
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Finishing Characteristics on Titanium Materials of Different Phase in Dry Centrifugal Barrel Finishing
Koichi Kitajima and Akihiro Yamamoto |
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Cutting Tool and Mold Technology |
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Improvement of Tool Life of Small Drill by Using Megasonic Coolant
Manabu Iwai, Shinichi Ninomiya, Masashi Nishizaki, Hirohisa Arai, Tetsutaro Uematsu, and Kiyoshi Suzuki |
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Application of the NiP-Plated Steel Molds to Glass Lens Molding
Jun Masuda, Jiwang Yan, and Tsunemoto Kuriyagawa |
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Influence of Tool Run-Out on Mold Surface Texture
Hideki Shibahara, Mikito Kumagai, Seido Kohda, and Koichi Okuda |
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Basic Research on Miniature Machining by Miniature End Mill
T. Akamatsu, K. Kitajima, and Y. Matsumoto |
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Grinding Wheels |
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Comparative Study About the Effects of Alloying Additives on the Compact and Porous Metal-Bonded
Diamond Composites
Qiulian Dai, Canbin Luo, and YuRong Lv |
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Microstructural Phase Formation in Surface Modified Vitrified Grinding Wheels
Mark J. Jackson and Grant M. Robinson |
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High Efficiency Monolayer Brazing Diamond Tool for Drilling
H.H. Su, H.J. Xu, B. Xiao, Y.C. Fu, and J.H. Xu |
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Fabrication and Characterization of Brazed CBN Wheels with Rhythmed Grain Distribution
Jiuhua Xu, Wenfeng Ding, and Yucan Fu |
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Surface Finishing (Analysis) |
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Differences in Effects of Cutting Edge Truncation on the Ground Surface Morphology Between
Hard and Brittle Material and Ductile Material
Xijun Kang, Jun’ichi Tamaki, and Akihiko Kubo |
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Finite Element Analysis of the Hydrostatic Pressure and Temperature in Ductile Machining of Silicon
Jiwang Yan, Hongwei Zhao, and Tsunemoto Kuriyagawa |
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Finite Element Analysis of Silicon Wafer Polishing: Stress Distributions and Edge Effects
X.H. Zhang, Z.J. Pei, and Graham R. Fisher |
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Surface Finishing (Turbine Parts) |
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Research of Gas Turbine Disk Sharp Edges Rounding with Nylon Abrasive Brushes
V.F. Makarov and A.V. Vinogradov |
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Surface Finishing (Fluids) |
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A Study of Basic Characteristics of Polishing Using Electro-Rheological Fluid of Polymerized Liquid Crystal
Takeshi Tanaka |
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Study on Tribo-Fabrication in Polishing by Nano Diamond Colloid
Weimin Lin, Teruko Kato, Hitoshi Ohmori, and Eiji Osawa |
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The Organic Diamond Disk (ODD) for Chemical Mechanical Planarization
James C. Sung, Cheng-Shiang Chou, Chih-Chung Chou, Yang-Liang Pai, Wei Huang,
Chia-Chun Wang, and Michael Sung |
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Tools and Tooling |
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Research on Helical Drill Point Grinding with a Bipod Parallel Grinder
P. Zou |
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Simulation of Squeeze Oil Film Damper in Ultrahigh Speed Grinding
Tianbiao Yu, Yadong Gong, Hu Li, and Wanshan Wang |
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Performance of Machining Tools Made of Boron Doped Diamond
Manabu Iwai, Shinichi Ninomiya, Yukinori Tanakai, Tetsutaro Uematsu, and Kiyoshi Suzuki |
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Development of a Cutting Tool with Micro Structured Surface (Cutting Performance of Aluminum Alloy
with the Developed Cemented Carbide Tool)
Ryo Takasaki and Toshiyuki Enomoto |
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Process Measurement (Thermal) |
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Experimental and Analytical Analysis of the “Flash” Temperatures at the Wheel/Workpiece Interface in
Fine Grinding
André Lefebvre, Paul Lipinski, and Pascal Vieville |
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Thermocouple Fixturing Method for Grinding Temperature Measurement
Bin Shen and Albert Shih |
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Grinding Temperature and Cooling Rate During Grind-Hardening of 40Cr Steel
B. Xiao, H.H. Su, S.S. Li, M.H. Yan, Y.C. Fu, J.H. Xu, and H.J. Xu |
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Process Monitoring |
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In-Process Measurement and Monitoring for Intelligent Optimization and Control of Grinding Processes
Radu Pavel and Anil Srivastava |
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Grinding Chatter Monitoring Using Least Square Support Vector Machine
Xun Chen and Thitikorn Limchimchol |
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Processes, Modeling, and Characteristics |
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Designing Methods of Electroabrasive Processing
E. Smolentsev |
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Friction Characteristics of Regulating Wheel in Centerless Grinding
Y. Wu and T. Tachibana |
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Force Modelling in Profiled Surface Grinding
S.J.H. Altena, V. Bana, and J.M. Derkx |
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Abrasive Processes |
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Study on the Key Technology of ELID Grinding on a Large Telescope Mirror
J. Guo, H. Ohmori, Y. Watanabe, S. Morita, and Y. Uehara |
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The Production of Automotive Crankshafts Using a High Material Removal Rate Grinding Process
P. Comley, W. Pflager, I. Walton, and D.J. Stephenson |
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Study of Helical Scan Groove Grinding—2nd Report: Application to R-Shaped Groove Grinding
Yoichi Shiraishi, Manabu Iwai, Lingshi Lin, Tetsutaro Uematsu, and Kiyoshi Suzuki |
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Hybrid Processing of EDM and Grinding with an ED-T-Formed PCD Tool
Sadao Sano, Weili Pan, Manabu Iwai, Shinichi Ninomiya, Tetsutaro Uematsu, and Kiyoshi Suzuki |
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Abrasive Process Controls |
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Development of Table-Reciprocation-Control System for a Surface-Grinding Machine
Using an Accelerometer
Akinori Yui, Shigeki Okuyama, and Takayuki Kitajima |
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Optimal Tool Dwell Time Computation in Computer-Controlled Surfacing
Hon-Yuen Tam, Hang-Wai Law, and Ka-Lok Liu |
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Improvement of an Automatic Wheel-Approach System Using a Hydrophone
Shigeki Okuyama, Akinori Yui, and Takayuki Kitajima |
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Grinding Special Materials (Metals) |
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Performance of Electroplated cBN Grinding Points Machining Udimet 720
D.T. Curtis, D.K. Aspinwall, S.L. Soo, C. Davis, and A.L. Mantle |
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Study of Internal Magnetic Field Assisted Finishing for Copper Tubes with Magneto-Rheological
Fluid (MRF)-Based Slurry—Finishing Characteristics Using Low-Viscous MRF-Based Slurry
T. Sato, H. Yamaguchi, T. Shinmura, and T. Okazaki |
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Grinding Special Materials (Non-Metals) |
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Creep Feed Grinding of Gamma-TiAl Using Superabrasive Wheels
R. Hood, D.K. Aspinwall, W. Voice, P. Dando, and K. Tuffy |
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Thin Tools for the High Speed Cutting of Granite
B. Denkena, M. Reichstein, J. Bockhurst, and B. Wang |
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Investigation of the Micro-End Grinding of Ceramics Using a Sintered Metal-Bonded Microgrinding Wheel
J. Feng, G.-Y. Kim, A.J. Shih, and J. Ni |
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Surface Finishing (Pads) |
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The Wear Characteristics of Pad Conditioners for CMP Manufacture of Semiconductors
James C. Sung, Ming-Yi Tsai, Eiichi Nishizawa, and Michael Sung |
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Pad Dressing Using Oriented Single Diamond and Its Effect on Polishing Rate of Oxidized Silicon Wafer
Y.S. Liao, M.Y. Tsai, J.C. Sung, and Y.L. Pai |
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Groove Patterns of Pads for Oscillation Polishing Under High Rotational Speeds and
Low Slurry Flow Rates
Kenichiro Yoshitomi, Atsunobu Une, and Masaaki Mochida |
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Development of Electric Field Assisted Polishing Technology Using ERG Abrasive Pad
Y. Kakinuma, S. Takezawa, T. Aoyama, M. Sagara, K. Tanaka, and H. Anzai |
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Nano/Micro Machining Technology |
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Study on Turning of Micro Shafts
Hwa-Soo Lee, Atsushi Toride, Takazo Yamada, and Shuichirou Araki |
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Ductile to Brittle Transition (DBT) of a Single-Crystal 4H-SiC Wafer by Performing Nanometric Machining
Deepak Ravindra, John Patten, and Makoto Tano |
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Study on Electrorheological Fluid Assisted Micro Ultrasonic Machining
T. Tateishi, N. Yoshihara, J. Yan, and T. Kuriyagawa |
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Nano/Micro Grinding Technology |
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Wear Performance of Ground Nanostructured Ceramic Coatings
Bi Zhang and XM Cheng |
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Grinding Force Prediction for Tungsten Carbides of Various Grain Sizes
Bi Zhang, YH Ren, and ZX Zhou |
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Precise and Micro V-Groove Grinding with Fine Grade PCD Wheel Formed by EDM
K. Suzuki, W. Pan, S. Sano, M. Iwai, and T. Uematsu |
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Technology Review |
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Grinding in the Aerospace Industry
Mike Hitchiner |
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High Process Quality with Fine Grinding Instead of Lapping
P. Dennis, D. Preising, and J. Sowada |
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Development of Micro cBN Milling Tool and Application to Precision Machining of
Hardened Stainless Steel Molds
Hirofumi Suzuki, Hiroki Kawabata, Yuji Yamamoto, Toshimichi Moriwaki, Yuji Goto, and Katsuji Fujii
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Measurement of Surfaces and Grains |
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Manufacturing of Functional Microstructured Surfaces by Grinding with Vitrified SiC- and CBN-Wheels
Berend Denkena, Martin Reichstein, and Bo Wang |
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Novel On-Machine Measurement of Surface Finish with Thermoelectric Effect for Rotating Ground Workpiece
Kazuhito Ohashi, Ryu Nagata, Shinya Tsukamoto, and Hiroyuki Hasegawa |
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Effects of the Embedding Depth on the Residual Stresses in the Brazed Cubic Boron Nitride |
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Abrasive Grain
Wenfeng Ding, Jiuhua Xu, Yucan Fu, Honghua Su, and Bing Xiao |
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Uncertainty and Quality in the Measurement and Characterization of the Texture of Abrasive Media
C.A. Brown, B.M. Powers, and T.S. Bergstrom |
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Machining Glass Materials |
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Subsurface Damage Caused During Rapid Grinding of Zerodur®
X. Tonnellier, P. Morantz, P. Shore, A. Baldwin, R. Evans, and D.D. Walker |
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Delayed Crack Developing on Ductile Mode-Machined Glass Surface
T. Kaneeda, H. Harada, T. Nishioka, and L. Anthony |
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Design of a Ball End Mill for Glass Cutting
Takashi Matsumura, Takenori Ono, Haruki Kino, and Yasushi Sakamoto |
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Abrasive Water-Jet |
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Two Dimensional Simulation for Gas-Solid-Liquid Three-Phase Flow of Abrasive Water Jet Nozzle and
Experimental Validation
C.Z. Huang, R.G. Hou, J. Wang, H.T. Zhu, and Y.X. Feng |
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A Three-Dimensional Parameter Research for the Surface Texture in a New Finishing Process
F. Liu, Y.D. Gong, Y.Q. Shan, and G.Q. Cai |
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A New Predictive Model for the Depth of Cut in Abrasive Waterjet Contouring of Alumina Ceramics
J. Wang |
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Momentum Transfer Efficiency in Abrasive Waterjet Cutting
Vu Ngoc Pi and A.M. Hoogstrate |
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Development of an Abrasive Tank Separated-Type AJM Device—Study on Abrasive Jet Machining
Nobuhito Yoshihara, Masaru Amaha, Jiwang Yan, and Tsunemoto Kuriyagawa |
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Abrasive Conditioning and Dressing (Metal Bonds) |
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Laser Truing and Dressing of Bronze-Bonded Diamond Grinding Wheel and Its High-Speed
Grinding Performance
G.Y. Chen, L.F. Mei, B. Zhang, W.M. You, J.Y. Yu, and K. Huang |
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On the Performance of Electro-Discharge Dressed Metal-Bond CBN Wheels
I. Pombo, J.A. Sanchez, R. Alberdi, B. Izquierdo, and L.N. Lopez de Lacalle |
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In-Process Electrolytic Dressing of a Metal Bonded Diamond Wheel by Using a
Flexible Fluid Supplying Sheet
Toshiharu Shimizu, Chiharu Nagano, Manabu Iwai, Shinichi Ninomiya, Mei Wang, Masatoshi Sakurai,
Tetsutaro Uematsu, and Kiyoshi Suzuki |
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In-Process Electrodischarge Dressing of Metal Bonded Diamond Wheels by Using a Floating Nozzle
Shinichi Ninomiya, Manabu Iwai, Mei Wang, Masatoshi Sakurai, Toshiharu Shimizu,
Tetsutaro Uematsu, and Kiyoshi Suzuki |
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Abrasive Conditioning and Dressing |
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Effect of Dressing Condition on the Contact Stiffness of Vitrified Grinding Wheels
Takazo Yamada and Hwa-Soo Lee |
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A Method for Synchronizing Grinding Wheel and Form Roll Speed in Point Crush Profiling of
Grinding Wheels
J.M. Derkx, A.M. Hoogstrate, B. Karpuschewski, and J.J. Saurwalt |
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Grinding Wheel Texture and Diamond Roll Plunge Dressing Feed-rates
C.A. Brown, R.S. Hahn, R.M. St. Gelais, B. Powers, D.J. Geiger, and T.S. Bergstrom |
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Powder Deposition
Study on Powder Jet Deposition—Development of Double Nozzle Type Powder Jet Deposition Device
Toshihiko Shibuya, Koichi Mizutani, Nobuhito Yoshihara, Jiwang Yan, Tsunemoto Kuriyagawa,
and Mohammad Saeed Sepasy Zahmaty |
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Creating a Hydroxyapatite Film on Human Enamel by Powder Jet Deposition Technique
Miyoko Noji, Mohammad Saeed Sepasy Zahmaty, Toshihiko Shibuya, Nobuhito Yoshihara,
Tsunemoto Kuriyagawa, Keiichi Sasaki, and Osamu Suzuki
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