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Advances in Abrasive Technology XIII Yunn-Shiuan, Chao-Chang, A Chen, Choug-Lii Chao, and Pei-Lum Tso Editors Selected, peer reviewed papers from joint 13th ISAAT conference and the 1st Cross Strait Conference on Precision Machining held September 19-22, 2010 Taipei Taiwan. 1045 pages (ISBN: 13-978-0-87849-242-8) Price: USD: 366.00 / EUR: 265.00 US price may change due to exchange rates. Order online Table of Contents Papers available separately. | |
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By Yasser M. Ali, Philip Mathew, Jun Wang ....3-8 Abstract By .... 9-13 Abstract By Hideaki Tanaka, Hiromu Chiba, Takeshi Yoshikawa, K. Iwatsuka, Yukio Maeda ....17- 22 Abstract By Xun Chen, Tahsin Tecelli ....23-28 Abstract By Vu Ngoc Pi, Tran Minh Duc ....29-34 Abstract By Quan Lai Li, Chuan Zhen Huang, Jun Wang, Hong Tao Zhu, Zeng Wen Liu ....35-40 Abstract By Berend Denkena, Luis de Leon, Leif Behrens ....41-46 Abstract By Ya Dong Gong, Jian Qiu, Yue Ming Liu, Jun Cheng ....47-51 Abstract By H. Gao, H.L. Ma, Yong Jie Bao, H.P. Yuan, Ren Ke Kang ....52-57 Abstract By Nobuhito Yoshihara, Ryoko Hiromatsu, Koichi Mizutani, Ji Wang Yan, Tsunemoto Kuriyagawa ....58-63 Abstract By Wei Li, Cheng Jin, Xiao Zhen Hu ....64-69 Abstract By Berend Denkena, Luis de Leon, Florian Seiffert ....70-76 Abstract By Wan Shan Wang, Peng Guan, Tian Biao Yu ....77-81 Abstract By Mao Li, Yong Wei Zhu, Jun Li, Jian Feng Ye, Ji Long Fan ....82-87 Abstract By Xiao Min Sheng, Li Guo, Kun Tang, Hai Qing Mi, Jian Wu Yu, Tao Chen ....88- 95 Abstract By Tian Biao Yu, Peng Cheng Su, Jing Qiang Zhang, Peng Guan, Wan Shan Wang ....96-100 Abstract By Yue Ming Liu, Ya Dong Gong, Jun Cheng, Ting Chao Han ....101-106 Abstract By Shigeki Okuyama, Akinori Yui, Takayuki Kitajima ....107-112 Abstract By Shang Gao, Ren Ke Kang, Dong Ming Guo, Quan Sheng Huang ....113-118 Abstract By Tian Biao Yu, Jing Qiang Zhang, Peng Guan, Wan Shan Wang ....119-124 Abstract By Un Chung Cho ....125-126 Abstract By Zhao Hui Deng, De Fang Cao, Xiao Hong Zhang, Hao Tang ....127-132 Abstract By Xavier Kennedy, S. Gowri ....133-138 Abstract By Bo Zhao, Ping Xie, Chong Yang Zhao ....139-142 Abstract By Yan Yan Yan, Bo Zhao, Jun Li Liu ....143-147 Abstract By Weng Seng Fong, Yee Ming Wan, David Lee Butler ....148-153 Abstract By Jian Wu Yu, Tao Chen, Zhen Tao Shang, Xiao Min Sheng, Gui Zhi Xie ....154-158 Abstract By Yasuhiro Tani, Tae Won Kim, Junji Murata, Yu Zhang, Sho Sawayama, Kousuke Tsutanaka ....159-164 Abstract By Wei Chan Chen, B.H. Yan, Shin Min Lee ....165-170 Abstract By Chih Hsiang Chang, Jhy Cherng Tsai, Neng Hsin Chiu, Rei Yu Chein ....171-176 Abstract By Chao Chang A. Chen, Pei Hsiun Chao ....177-180 Abstract By Bing Hai Lv, Ju Long Yuan, Qian Fa Deng, Zhi Wei Wang ....181- 186 Abstract By Bulent Tiryaki, Ian D. Gipps, Xing S. Li ....189-194 Abstract By Gusri Akhyar Ibrahim, Che Hassan Che Haron, Jaharah Abd. Ghani ....195- 201 Abstract By Kohichi Miura, Takazo Yamada, Hwa Soo Lee ....202-207 Abstract By Jian Long Kuo, Chung Hao Hsieh ....208-213 Abstract By Osamu Horiuchi, Bo Xiao Ma, Mitsuyoshi Nomura, Takayuki Shibata, Yoshihiko Murakami, Masami Masuda ....214- 219 Abstract By Bin Shen, Fang Hong Sun, Dong Can Zhang .... 220-225 Abstract By Fang Hong Sun, Bin Shen, Guo Dong Yang ....226-231 Abstract By Takahiro Takechi, Junichi Tamaki, Akihiko Kubo, A.M.M. Sharif Ullah ....235-240 Abstract By Sheng Qiang Jiang, Yuan Qiang Tan, Gao Feng Zhang, Rui Tao Peng, Dong Min Yang ....241-245 Abstract By Hiroo Shizuka, Koichi Okuda, Masayuki Nunobiki, Wei Li, Takanobu Inaoka ....246-251 Abstract By Keisuke Hara, Hiromi Isobe, Shuichi Chiba, Keiko Abe ....252- 257 Abstract By Yan Ming Quan, Jia Jia Chen, Hao Xu ....258-262 Abstract By Jhy Cherng Tsai, Hong Shin Chen ....263- 268 Abstract By Hung Jung Tsai, Jeng Haur Horng, Hung Cheng Tsai, Shun Jung Chiu, Pay Yau Huang ....271-275 Abstract By Shih Hsiang Chang ....276-281 Abstract By Zhen Zhong Wang, Yong Bo Wu, Li Bo Zhou, Yin Biao Guo, Chen Xu Wu ....282-288 Abstract By Nobumasa Yokemura, Kenichiro Imai, Hiroshi Hashimoto ....289-294 Abstract By Jung Taik Lee, Eun Sang Lee, Jong Koo Won, Hon Zong Choi ....295- 304 Abstract By Ian Hu, Tian Shiang Yang, Kuo Shen Chen ....305-310 Abstract By Pei Lum Tso, Yao Cheng Chang ....311-315 Abstract By Jhy Cherng Tsai, Wei Ching Lin ....316-319 Abstract By Ming Yi Tsai, W.Z. Yang ....320-325 Abstract By Ying Tung Chen, Ta Wei Lin, Yunn Shiuan Liao, Jung Sheng Chen, Chao Yu Lin, James C. Sung ....326-331 Abstract By Ying Tung Chen, Chen Chin Yu, Cheng Shiang Chou, Chih Chung Chou, Yang Liang Pai, Zong Qing Yang, Mu Han Cheng, Tien Chen Hu, Michael Sung, James C. Sung ....332-337 Abstract By Feng Jiang, Jian Feng Li, Jie Sun, Song Zhang, Lan Yan ....341-346 Abstract By Jaharah Abd. Ghani, Mohd Nor Azmi Mohd Rodzi, Kamal Othman, Che Hassan Che Haron ....347-352 Abstract By Yunn Shiuan Liao, Y.P. Yu, C.H. Chang ....353-358 Abstract By Xiang Long Zhu, Ren Ke Kang, Yong Qing Wang, Dong Ming Guo ....361-366 Abstract By Zhi Qiang Liang, Xi Bin Wang, Yong Bo Wu, Wen Xiang Zhao ....367-372 Abstract By Kohichi Miura, Masayuki Takahashi, Takazo Yamada, Hwa Soo Lee ....375-380 Abstract By Kuen Ming Shu, Chih Shiang Chang, Wei Jun Chuang, Shi Iun Wang, Yau Yheng Jang ....381-387 Abstract By Masayuki Nunobiki, Koichi Okuda, Kousuke Hourai, Hiroo Shizuka ....388-393 Abstract By C.W. Cheng, J.S. Chen, P.X. Lee, C.W. Chien ....394-400 Abstract By Peng Yao, Takuro Abe, Nobuhito Yoshihara, Tian Feng Zhou, Ji Wang Yan, Tsunemoto Kuriyagawa ....401-406 Abstract By Ke Yu Shue, Yao Yang Tsai, Yo Ming Chang ....407-412 Abstract By Sachiko Ogawa, Shinpei Okumura, Toshiki Hirogaki, Eiichi Aoyama, Yoshiaki Onchi ....415-420 Abstract By Kazuya Yamamura, Tatsuya Takiguchi, Masaki Ueda, Azusa N. Hattori, Nobuyuki Zettsu ....423- 428 Abstract By Yong Guang Wang, Liang Chi Zhang ....429- 434 Abstract By Fei Hu Zhang, Xing Bin Yu, Yong Zhang, Yong Yong Lin ....435-440 Abstract By Shinichi Ninomiya, Manabu Iwai, Kazuyoshi Takano, Toshiharu Shimizu, Kiyoshi Suzuki ....441- 446 Abstract By Ken Chuan Cheng, Kuan Yu Chen, A Cheng Wang, Yan Cherng Li ....447- 456 Abstract By Shizuichi Higuchi, Mitsuru Sugisaki, Hideo Kato, Kazuya Okawa ....457-462 Abstract By Pai Shan Pa ....463-468 Abstract By Alex Fang, Elena Castell Perez, Alex Puerta Gomez, Song Sheng Zhou, Jason Sowers ....469-474 Abstract By Yin Biao Guo, Wei Yang, Zhen Chen, Yun Feng Peng ....475- 480 Abstract By Wataru Natsu, Takeshi Miyata ....481-486 Abstract By Feng Jiao, Chong Yang Zhao, Bo Zhao ....487- 492 Abstract By Takao Kubo, Shiro Ota, Masatoshi Oda, Kenichi Hashishita, Yasuhiro Kakinuma ....493-498 Abstract By Shingo Tsubota, Wataru Natsu ....499-504 Abstract By Arif Wahjudi, Fang Jung Shiou ....505-510 Abstract By Yong Guang Wang, Liang Chi Zhang, Altabul Biddut ....511-514 Abstract By Gui Bing Pang, Xieeryazidan Adayi, Wen Ji Xu, Y.P. Peng, J.J. Zhou ....515-520 Abstract By Shinichi Ninomiya, Manabu Iwai, Gaku Sugino, Takuya Takada, Kiyoshi Suzuki ....521-526 Abstract By Mîng Chih Hung, Yao Yang Tsai, Lin Wang ....527-532 Abstract By Pulse Electrochemical Finishing with a Moving Cathode By Gui Bing Pang, Wen Ji Xu, Jin Jin Zhou, Dian Ming Li ....533-538 Abstract By Sung Lin Tsai, Fuang Yuan Huang, B.H. Yan, Yao Ching Tsai ....539-544 Abstract By Wen Ji Xu, W. Wang, Xu Yue Wang, Gui Bing Pang ....545-550 Abstract By Choung Lii Chao, Ying Ching Hsiao, Wen Chen Chou, Chia Wei Kuo, Wen Lang Lai, Hung Yi Lin, Kung Jeng Ma ....551- 556 Abstract By Yow Ching Liaw, Jung Hua Chou ....559-563 Abstract By Shao Hui Yin, Ke Jun Zhu, Yu Fang Wang, Feng Jun Chen, Yu Wang ....564-569 Abstract By Yong Bo Wu, Zhi Qiang Liang, Xi Bin Wang, Wei Min Lin ....573-578 Abstract By Akihiko Kubo, Junichi Tamaki, A.M.M. Sharif Ullah ....579-584 Abstract By Shenq Yih Luo, J.K. Ho, Ming Yi Tsai, Y.S. Liou, W.E. Chen ....585-590 Abstract By Manabu Iwai, Shinichi Ninomiya, Gaku Sugino, Kiyoshi Suzuk ....591-596 Abstract By Jeffrey Badger, Stuart Murphy, Garret E. O'Donnell ....597-602 Abstract By Lan Yan, Zhi Xiong Zhou, Feng Jiang, Yi Ming Rong ....603-608 Abstract By Masahiro Furuno, Koichi Kitajima, Yousuke Tsukuda, Takeshi Akamatsu ....609-614 Abstract By Taghi Tawakoli, Bahman Azarhoushang ....615-620 Abstract By Wen Feng Ding, Jiu Hua Xu, Z.Z. Chen, Hong Hua Su, Yu Can Fu, Y. Chen ....621-626 Abstract By Kenichiro Imai, Hiroshi Hashimoto ....627-632 Abstract By Tai Jia Chen, Rong Tsong Lee, Yuang Cherng Chiou ....633-638 Abstract By Manabu Iwai, Shinichi Ninomiya, Gaku Sugino, Kiyoshi Suzuk ....639-644 Abstract By Gaku Sugino, Manabu Iwai, Tadakazu Sano, Shinichi Ninomiya, Kiyoshi Suzuki ....645-650 Abstract By Guang Ming Zheng, Jun Zhao, Xin Yu Song, Qing Yuan Cao, Yue En Li ....653-657 Abstract By Z.F. Wei, Wen Ji Xu, Gui Bing Pang, Xu Yue Wang ....658-663 Abstract By Huai Ying Fang, Yuan Li, Hui Huang, Xi Peng Xu ....667-671 Abstract By A.M.M. Sharif Ullah, Junichi Tamaki, Akihiko Kubo ....672-677 Abstract By Chao Ching Ho, Tzu Hsin Kuo, Tsung Ting Tsai ....678-683 Abstract By T. Tachikawa, Kazuhito Ohashi, M. Tago, Shinya Tsukamoto ....684-689 Abstract By David Lee Butler ....690-695 Abstract By Gui Jian Xiao, Yun Huang, Z. Huang, Li Na Si ....696-700 Abstract By Teppei Onuki, Takashi Tokizaki, Hirotaka Ojima, Jun Shimizu, Li Bo Zhou ....701-706 Abstract By Jun Zhang, Bo Liu, Min Qian, Xiang Long Zhu, Ren Ke Kang ....707-712 Abstract By a Ball Screw By Ginsuke Kono, Takaharu Kuroda, Teruyoshi Daitoh, Kuniaki Maruoka ....713-718 Abstract By Chia Liang Yen, Ming Chyuan Lu, Jau Liang Chen ....719-725 Abstract By Gunsei Kimoto, Takehiro Watanabe, Souta Matsusaka, Akio Inoue, Takaharu Kuroda ....726-731 Abstract By Kazutaka Nonomura, Masashi Ono, Li Bo Zhou, Jun Shimizu, Hirotaka Ojima ....732-737 Abstract By Jaharah Abd. Ghani, Muhammad Rizal, Mohd Zaki Nuawi, Che Hassan Che Haron, Mariyam Jameelah Ghazali, Mohd Nizam Ab Rahman ....738-743 Abstract By Hsi Hsun Tsai, Hui Ping Feng ....744-751 Abstract By Ming Chen, Xiao Hui Zhang, Bing Han, Bin Rong, Gang Liu ....755-759 Abstract By Chung Shin Chang ....760-766 Abstract By Ke Zhang, De Hong Zhao, Hua Guo, Bao Jia Hou, Yu Hou Wu ....767-772 Abstract By Yung Tien Liu, Neng Hsin Chiu, Yen Chun Lin, Chih Liang Lai, Yu Fu Lin, Hung Hsiang Chiu ....773-778 Abstract By Yi Xin Yang, Cheng Yong Wang, Zhe Qin, Lin Lin Xu, Yue Xian Song, Han Yuan Chen ....779-784 Abstract By Shih Ming Wang, Han Jen Yu, Da Fan Chen ....785-790 Abstract By Ping Zou, Xu Lei Yang, Jin Zhong Xu, Wen Yuan Tian, Ming H ....791-795 Abstract By Shun Tong Chen, Zong Han Jiang, Yi Ying Wu, Hong Ye Yang ....802-807 Abstract By Shi Chao Xiu, Shi Qiang Gao, Zhi Li Sun ....808-813 Abstract By Taro Sumitomo, Li Bo Zhou, Han Huang ....817-822 Abstract By Yunn Shiuan Liao, J.Y. Lin, Y.C. Chung, T.Y. Yang ....823-828 Abstract By G. Yin, Z. Yu, C. An, J. Li ....829-834 Abstract By Kazuya Demura, Satoru Hirose, Tohru Ihara ....835-842 Abstract By Wataru Ohsone, Jun Shimizu, Li Bo Zhou, Hirotaka Ojima, Teppei Onuki, Takeyuki Yamamoto, Han Huang ....843-848 Abstract By Je Ee Ho, Chen Lung Yen ....849-854 Abstract By Jin Xie, Y.X. Lu, Y.W. Zhuo ....855-860 Abstract By Je Ee Ho, Hong Tsu Young ....861-866 Abstract By Jian Long Kuo, Chun Cheng Kuo ....867-872 Abstract By C.S. Leo, David Lee Butler, Sum Huan Ng, Steven Danyluk ...873-878 Abstract By Y. Zhang, Y. Gao, J. You ....879-884 Abstract By K.P. Somashekhar, N. Ramachandran, Jose Mathew ....885-890 Abstract By Ming Jun Chen, Wen Bin Jiang ....891-896 Abstract By Guo Qiang Guo, Zhi Qiang Liu, Xiao Jiang Cai, Qing Long An, Ming Chen ....899-904 Abstract By Mariyam Jameelah Ghazali, Mahamad Noor Wahab, Abdul Razak Daud, Jaharah Abd. Ghani ....905-910 Abstract By Yuan Wei Wang, Song Zhang, Jian Feng Li, Tong Chao Ding ....911-916 Abstract By S.H. Sung, Y.C. Cheng, A.H. Tan ....917-922 Abstract By Ming Chen, Bin Zou, Shu Qiao Zhang, Bin Rong, Gang Liu ....923-928 Abstract By Hsiang Chen Hsu, Shen Wen Ju, Jie Rong Lu, Yue Min Wan ....929-934 Abstract By Min Hu, Ying Liu ....935-939 Abstract By Zhi Gang Dong, C.W. Kang ....940-945 Abstract By Ke Ju Chou, Hatsuhiko Usami, Kazuki Enomoto ....946-951 Abstract By Ching Yen Ho, Yu Hsiang Tsai, Feng Ming Sui ....952-956 By Chih Ling Lin, Han Huang, Bronwen W. Cribb, Anthony Russel ....957-962 Abstract By Yu Tao Yan, Zhi Li Sun, Tao Zhu ....965-969 Abstract By Hsi Hsin Chien, Kung Jeng Ma, Yun Peng Yeh, S. Prabhakar Vattikuti, Chien Hung Kuo, Choung Lii Chao ....970-975 Abstract By Zhi Li Sun, Yun Feng Zhang, Yu Tao Yan ....976-980 Abstract By Long Chen Duan, Shao Lin Xu, Hao Shi, Jun Ping Li ....981-986 Abstract By Zheng Yi Jiang, Jian Ning Tang, Anh Kiet Tieu, Wei Hua Sun, Dong Bin Wei ....987-992 Abstract By Hong Hua Su, Yu Can Fu, Jiu Hua Xu, Wen Feng Ding, Hong Jun Xu ....995-1000 By Haruhisa Sakamoto, Shinji Shimizu ....1001-1006 Abstract By Shao Hui Yin, Kun Tang, Hitoshi Ohmori, Xian Liang Zeng, Feng Jun Chen, Yu Wang ....1007- 1012 Abstract By James C. Sung, Ming Yi Tsai, Cheng Shiang Chou, Pei Lum Tso, Ying Tung Chen ....1013-1018 Abstract By Q.L. Han, Wen Ming Zhang ....1019-1022 By Yan Hua Zou, An Yuan Jiao, Toshio Aizawa ....1023-1028 Abstract By Ping Zhao, Qian Fa Deng, Bing Hai Lv, Wei Hang, Zhi Wei Wang, Ju Long Yuan ....1029- 1033 Abstract |
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(EUAG) 573-578 (MRR) 311-315 3D Surface Finish 672-677 5-Axis Machine Tool 785-790 Abrasion 873-878 Abrasive 133-138 Abrasive 148-153 Abrasive 3-8 Abrasive Blasting 29-34 Abrasive Cleaning 29-34 Abrasive Flow Machining 447-456 Abrasive Grits 23-28 Abrasive Jet 3-8 Abrasive Jet Machining 946-951 Abrasive Machining 1019-1022 Abrasive Machining 125-126 Abrasive Wear 195-201 Abrasive-Free Polishing 316-319 Acoustic Emission (AE) 719-725 Acoustic Wave 246-251 Adaptive Neuro-Fuzzy Inference System (ANFIS) 171-176 Adhesive Wear 195-201 Advanced Ceramic 252-257 AFM Probe 835-842 Ag-Cu-Ti Alloy 621-626 Air 407-412 Al/SiC-MMC 220-225 AlN 905-910 Al-Si Alloy 905-910 Altitude Density Function 658-663 Alumina 511-514 Aluminium Alloy 107-112 Aluminium Silicon Alloy 226-231 Analysis of Variance (ANOVA) 381-387 Anisotropic Conductive Film (ACF) Attach Process 208-213 Anodic Oxidation 701-706 Approach Angle 202-207 Aspect Ratio 35-40 Aspect Ratio 829-834 Aspect Ratio 855-860 Aspheric Surface 499-504 Assisted Machining 252-257 Assisted Machining 311-315 Atmospheric Pressure Plasma 423-428 Atomic Force Microscope (AFM) 17-22 Atomic Force Microscope (AFM) 843-848 Attachment 407-412 Auto Correlation Function 658-663 Automatic Moving Measurement 713-718 Ball 125-126 Ball Screw 713-718 Belt Grinding 133-138 Belt Wear 133-138 Bending 388-393 Best Fitting Sphere 564-569 Blob 597-602 Bond 585-590 Bone Drilling 779-784 Boron-Doped Diamond (BDD) 591-596 Boron-Doped Diamond (BDD) 645-650 Brazing 995-1000 Brazing Interface 621-626 Brittle 3-8 Brittle Material 627-632 Brittle Mode 401-406 Brittle Wafer 429-434 Buffing 493-498 CaF2 Crystal 891-896 Camshaft Grinding 127-132 Carbide Insert 195-201 Carbide Tip's Surface Temperature 760-766 Carbide Tool 347-352 Carbomer 469-474 Carbon Fiber Reinforced Polymer (CFRP) 52-57 Carbon Nanotube (CNT) 879-884 Case Case Based Reasoning (CBR) 127-132 Cast Iron 755-759 CBN Tool 252-257 Cemented Carbide 1007-1012 Ceramic 258-262 Ceria 511-514 Ch Computing Environment 295-304 Characteristic 88-95 Characterization 603-608 Charging 17-22 Chatter 214-219 Chemical Corrosion 316-319 Chemical Mechanical Polishing (CMP) 271-275 Chemical Mechanical Polishing (CMP) 276-281 Chemical Mechanical Polishing (CMP) 311-315 Chemical Mechanical Polishing (CMP) 320-325 Chemo-Mechanical Grinding (CMG) 282-288 Chemo-Mechanical Polishing 511-514 Chip 879-884 Clean 208-213 CMP 1013-1018 CMP 326-331 CMP 332-337 CMP 429-434 CNT CNT Uncut Chip Model 879-884 CO2 Laser Irradiation 401-406 Cobalt Bond 585-590 Coherent Light Scattering 744-751 Cold Air Cutting 341-346 Combined Device 713-718 Compact Robot 415-420 Complex Grinding Assisted with Complex Grinding Assisted with Composite Electro-Plating In-Process Sharpening (CEPIS) 633-638 Concrete 70-76 Conductive Diamond 521-526 Contact Area 101-106 Contact Condition 41-46 Contact Force 726-731 Contact Mechanics 276-281 Contact Mechanics 305-310 Contact Stress Uniformity 305-310 Control 35-40 Coordinate Polishing with Abrasive Tap 696-700 Copper Electrode 521-526 Copper Film Corona Ignited Micro-Discharge Welding (CIMDW) 823-828 Cortical Bone 957-962 Crack 940-945 Crack Pass 946-951 Crankpin 696-700 Crankshaft Critical Depth of Cut 263-268 Cross Grinding 579-584 CrSiN Coating Film 609-614 Curved Surface Shape 388-393 Cutterhead Simulation 189-194 Cutting 189-194 Cutting 35-40 Cutting Force 214-219 Cutting Force 923-928 Cutting Grain 879-884 Cutting Parameter 667-671 Cutting Performance 220-225 Cutting Performance 226-231 Cutting Performance 755-759 Cutting Temperature 923-928 Cutting Tool 639-644 Cutting-Edge Density 1001-1006 CVD 970-975 CVD Diamond Film 633-638 CVI-SiC/SiC Composite 946-951 Cylindrical Grinding 684-689 Cylindrical Specimen 551-556 Cylindricity 202-207 Damage Free 423-428 Deformation 940-945 Design 767-772 Design of Experiments (DOE) Method 867-872 Diamond 995-1000 Diamond Bit Matrix 981-986 Diamond Circular Saw Blade 667-671 Diamond Conditioner 320-325 Diamond Cutting 246-251 Diamond Disk 332-337 Diamond Grinding Wheel 113-118 Diamond Grinding Wheel 855-860 Diamond Orientation 326-331 Diamond Probe 843-848 Diamond Tool 585-590 Diamond Tool 70-76 Diamond Wheel 107-112 Diamond Wheel 573-578 Dicing-then-Breaking 263-268 Digital Elevation Model (DEM) 241-245 Digital Filter 732-737 Digital Machining 672-677 Dissolving 545-550 DLC 220-225 Double-Sided Polishing Process 64-69 Dressing 1001-1006 Dressing 995-1000 Drill Point Grinding 791-795 Drilling Force 779-784 Drilling Temperature 779-784 Drilling-Grinding 258-262 Dry Turning 347-352 Ductile 3-8 Ductile Mode 246-251 Ductile Mode 401-406 Ductile Mode 891-896 Ductile Mode Grinding 627-632 Ductile Mode Machining 289-294 Ductile Regime Machining 235-240 Duty Factor 407-412 Dynamometer 361-366 Eco-Friendly 415-420 EC-PCD 521-526 EC-PCD 591-596 EC-PCD 645-650 EDM 527-532 EDM 591-596 EDM 645-650 EDM Property 521-526 EDM-Drilling 802-807 Elastic Recovery 235-240 Electrical Contact Resistance 726-731 Electrically Electrically Conductive Diamond 591-596 Electrically Conductive Diamond 639-644 Electrically Conductive Diamond 645-650 Electrochemical Deburring 545-550 Electrochemical Dissolution 873-878 Electrochemical Finishing 463-468 Electrochemical Finishing 533-538 Electrochemical Machining 515-520 Electrochemical Mechanical Electrochemical Mechanical Finishing 658-663 Electrode Size 527-532 Electrokinetic 873-878 Electromigration 929-934 Electrophoresis 481-486 Electroplating Diamond 258-262 Electrorheological Effect 527-532 Electro-Thermo-Mechanical Design 929-934 Elliptical Ultrasonic Assisted Grinding Elliptical Ultrasonic Assisted Grinding (EUAG) 367-372 Encapsulation Molding Compound 559-563 Engineering Ceramics 487-492 Environmental Impact 415-420 Erosion 3-8 Erosion 873-878 Error Measurement 785-790 Ethylene-Vinyl Acetate (EVA) 539-544 Evaluation 493-498 Experiment 808-813 Experimental Investigation 241-245 Expert System 127-132 Fatigue 214-219 FCD700 Cast Iron 347-352 Feed Rate 214-219 Femtosecond Laser 394-400 Ferrite 995-1000 Fiber Direction 52-57 Finish 347-352 Finish 463-468 Finishing 515-520 Finishing 515-520 Finishing Characteristics 457-462 Finite Difference Method (FDM) 52-57 Finite Element Analysis (FEA) 23-28 Finite Element Analysis (FEA) 341-346 Finite Element Method 760-766 Five-Axis Grinding 41-46 Fixed Abrasive 17-22 Fixed Abrasive Pad (FAP) 82-87 Fixed-Abrasive Polishing 415-420 Flaking 195-201 Flatness 82-87 Flexing 133-138 |
Floating Polishing 551-556 Fly Cutting 252-257 Force 202-207 Force 271-275 Force 457-462 Force Measurement 47-51 Fourier Filtering 603-608 FPP 475-480 Fracture 263-268 Free Form 499-504 Frequency 139-142 Frequency 767-772 Friction 981-986 Friction 987-992 Friction Coefficient 981-986 Fused Gear 533-538 Geometric Simulation 77-81 Geometrical Accuracy 202-207 Glass 258-262 Glass Substrate 917-922 Glass Surface 415-420 Grain Arrangement 107-112 Granite 981-986 Graphite 1013-1018 Grinder 361-366 Grinder 707-712 Grinder 791-795 Grinding 113-118 Grinding 119-124 Grinding 143-147 Grinding 159-164 Grinding 23-28 Grinding 367-372 Grinding 591-596 Grinding 597-602 Grinding 645-650 Grinding 672-677 Grinding 690-695 Grinding 88-95 Grinding 899-904 Grinding 96-100 Grinding Dynamometer 707-712 Grinding Efficiency 457-462 Grinding Energy 615-620 Grinding Fluid 107-112 Grinding Force 1007-1012 Grinding Force 154-158 Grinding Force 361-366 Grinding Force 47-51 Grinding Force 573-578 Grinding Force 615-620 Grinding Force 88-95 Grinding Machine 808-813 Grinding Mechanism 47-51 Grinding Performance 621-626 Grinding Speed 154-158 Grinding Surface 609-614 Grinding Temperature Field 52-57 Grinding Wheel 1001-1006 Grinding Wheel Topography 603-608 Groove Machining Groove Machining Accuracy 835-842 Ground Surface Topography 579-584 Hard Material 627-632 Hardened Steel 773-778 Hardness 957-962 Heat Transfer 952-956 Heat Transfer Analysis 58-63 Heat Treatment 159-164 Heat Treatment 905-910 Helical Drill Point 791-795 Helical Passageway 447-456 HFCVD 220-225 HFCVD 226-231 High Efficiency Deep High Speed Grinding 154-158 High Speed Turning 653-657 High-Speed Machining 773-778 Home Ion Generator 441-446 Horizontal-Axis-Type Rotary Surface Grinding 579-584 Hybrid Journal Bearing 808-813 IC Package 559-563 I-kaz Method 738-743 Inconel 718 653-657 Inner Wall Polishing 165-170 In-Process Measurement 684-689 Interface Strength 946-951 Intermittent Grinding 615-620 Intermittent Removal Process 627-632 Jet Beam 9-13 Lapping 1029-1033 Lapping 17-22 Lapping 423-428 Lapping 469-474 Large Particle 181-186 Laser Assisted 58-63 Laser Forming 388-393 Life Cycle Assessment 415-420 Lifting Wavelet 732-737 Liquid Flow 829-834 Lithium Niobate 246-251 Loading 597-602 Lotus Effect 353-358 Lubrication LVQ 719-725 Machine Monitoring 678-683 Machined Surface 923-928 Machining 148-153 Machining 3-8 Machining 77-81 Machining Center 767-772 Machining Characteristics 481-486 Machining Efficiency 282-288 Machining Force 289-294 Machining Rate 946-951 Machining Simulation 96-100 Magnetic-Assistance 463-468 Magnetron Sputtering 935-939 Material 88-95 Material Removal Material Removal 1023-1028 Material Removal Characteristics 487-492 Material Removal Mechanism 946-951 Material Removal Model 435-440 Material Removal Rate Material Removal Rate (MRR) 849-854 Material Type 835-842 Materials Removal Ratio 407-412 Mathematical Model 738-743 Measurement 732-737 Mechanical Micro-Machining 719-725 Mechanical Property 891-896 Media 148-153 Metal Particles 559-563 Method (RSM) 867-872 Micro Abrasive Suspension Slurry 9-13 Micro Air Abrasive Jet 35-40 Micro Aspheric Glass Lens 564-569 Micro Ball-End Mill 773-778 Micro EDM 375-380 Micro EDM 829-834 Micro Grinding 855-860 Micro Groove 375-380 Micro Machining 375-380 Micro Wire Electric Discharge Grinding (µ-WEDG) 885-890 Micro-Electrode 375-380 Microflaking 970-975 Micro-Hole 375-380 Micro-Hole 829-834 Micro-Morphology 1007-1012 Microparticle 952-956 Microstructure 394-400 Microstructure Characterization 621-626 Microtechnology 823-828 Microwelding 823-828 Mill 214-219 Milling Tool 220-225 Mini-Disc 189-194 Mirror 125-126 Mode 835-842 Modeling 545-550 Modification 533-538 Modulation Period 935-939 Mold 843-848 Monitoring 738-743 Motion 475-480 MQL 353-358 Multi Straight-Line Multi-Objective Nano Cluster Diamond 917-922 Nano Machining 879-884 Nano Particles Cutting Fluid 353-358 Nano-Composite Ceramic 139-142 Nano-Fabrication 701-706 Nanogrinding 817-822 Nanoimprint Lithography 843-848 Nanoindentation 235-240 Nanoindentation 957-962 Nanolayer 817-822 Nanolithography 701-706 Nanometer 873-878 Nanoscratching 843-848 Nanosheet 835-842 Nano-Surface 415-420 Negative Ions 441-446 Nickel Chloride 633-638 NiP Plate Noise 732-737 Nonlocal Theory 139-142 Normal Process 976-980 Nozzle-Type ELID Grinding 1007-1012 Numerical Odor Suppression 441-446 on Wafer 316-319 Online Measurement 696-700 Online Tool Wear Optical Grade Glass 802-807 Optimal Cutting Parameter 911-916 Optimization 29-34 Optimized Pattern 82-87 Overcut 885-890 Overdrive 726-731 Oxidation 597-602 Oxide Scale 987-992 Package-on-Package 929-934 Pad 1013-1018 Pad Conditioner 1013-1018 Pad Conditioner 332-337 Pad Dressing 326-331 Parallel Grinding 579-584 Particle Erosion 559-563 Particle Size 952-956 Passivant 316-319 PCD 326-331 PCD 521-526 PCD 585-590 PCD 591-596 PCD 639-644 PCD 645-650 PDC 469-474 Peak Current 407-412 pH 511-514 Photodiode 744-751 Photosensitive Glass 394-400 Photovoltaic Energy 125-126 Piezoelectric Effect 707-712 Pile-Up 235-240 Planarization 311-315 Plane Magnetic Abrasive Finishing Planning 435-440 Plasma 823-828 Plastic Flow 970-975 Plate Material 17-22 Plug Dishing 276-281 Point-Attack Pick 189-194 Polish 527-532 Polish 917-922 Polishing 493-498 Polishing 499-504 Polishing 551-556 Polishing 817-822 Polishing 9-13 Polishing Condition 493-498 Polishing Pad 320-325 Polishing Pad 539-544 Polishing Process 505-510 Polishing Trajectory of Magnetic Brush 1023-1028 |
Polycrystalline CBN Abrasive Grai 621-626
Polycrystalline Diamond Compact 469-474 Polyline Dwell Time 435-440 Powder 952-956 Powder Jet Deposition 58-63 Predictive Model 35-40 Pressure Standard Deviation 64-69 Pre-Stressed Machining 241-245 Probability Distribution of Chip Thickness 101-106 Process 1023-1028 Process 171-176 Process 289-294 Process 672-677 Process Parameter 119-124 Process Parameter 96-100 Processing Heat 258-262 Property 639-644 Protrusion 585-590 Pulsed Ablation 861-866 Putrefaction of Coolant 441-446 PVD Coating 609-614 Pyramid-Structured Surface 855-860 Quartz Crystal 707-712 Quartz Glass 235-240 Random Process 976-980 Rate 511-514 Rate 965-969 Ratio 591-596 Ratio 645-650 Reality 96-100 Reduced Modulus 957-962 Reference Ratio of Gap Voltage 407-412 Reflectivity 935-939 Regression Analysis 965-969 Reinforced Particle 905-910 Relative Electrode Removal 133-138 Removal 873-878 Reparation 58-63 Representation 127-132 Residual Stress 143-147 Residual Stress 923-928 Response Surface Response Surface Method (RSM) 208-213 Reverse Co-Centric Micro-Hole Rotational Tool 289-294 Roughness 101-106 Roughness 271-275 Roughness 447-456 Roughness 539-544 Roughness 684-689 Roughness 911-916 Roughness 987-992 Sand Blasting 29-34 Sand Cleaning 29-34 Sapphire 367-372 Sapphire 429-434 Sapphire 573-578 Scanning Probe Microscope 701-706 Scanning Speed 499-504 Scratch 940-945 Scratch-Free 423-428 Scribing 263-268 Scrub 726-731 Segmented Wheel 615-620 Semiconductor 332-337 Semi-Fixed Abrasive Tool 1029-1033 Semi-Fixed Abrasive Tool 181-186 Sensor 678-683 Sensor Signal Monitoring 295-304 Serrated Chip 653-657 Sheet Resistance 935-939 Si Wafer 289-294 Sialon Ceramic Tool 653-657 Signal to Noise Ratio 911-916 Silica 401-406 Silicon 177-180 Silicon Carbide (SiC) 423-428 Silicon Carbide (SiC) 429-434 Silicon Nitride Insert 226-231 Silicon Wafer 113-118 Silicon Wafer 295-304 Silicon Wafer 361-366 Silicon Wafer 579-584 Silicon Wafer 707-712 Silicon Wafer 732-737 Silicon Wafer 843-848 Simulation 119-124 Simulation 241-245 Simulation 564-569 Simulation 767-772 Simulation 808-813 Simulation 891-896 Single Crystal MgO 940-945 Single-Point Diamond Dresser 1001-1006 Single-Point Fly Cutting 235-240 Sliding Control 505-510 Slotting 214-219 Sn4.0Ag0.5Cu Solder Ball 929-934 Solar Cell 177-180 Solar Cell Efficiency 125-126 Solar Energy Transmission 678-683 Solar Panel 817-822 Solder Bead 867-872 Solder Residue 867-872 Sound Wave Welding Head 381-387 Specific Energy 189-194 Specific Grinding Energy 88-95 Sphere-Like Polishing Spherical Indenter 235-240 Spiral Polishing 165-170 Stability 64-69 Stable Grinding Force 591-596 Stainless Steel 760-766 Steel Manufacturing 987-992 Stochastic Stone 667-671 Stone 767-772 Straightness 713-718 Stress 475-480 Structured Lapping Film 457-462 Submodel Scheme 929-934 Subsurface Damage 113-118 Subsurface Damage 401-406 Super-High Speed Point Grinding 101-106 Super-High Speed Point Grinding 47-51 Surface 609-614 Surface Accuracy 282-288 Surface Condition 645-650 Surface Creation 499-504 Surface Damage 282-288 Surface Grinding 107-112 Surface Integrity 899-904 Surface Morphology 1019-1022 Surface Quality 171-176 Surface Quality 367-372 Surface Quality 515-520 Surface Quality 658-663 Surface Roughness 1001-1006 Surface Roughness 1019-1022 Surface Roughness 1023-1028 Surface Roughness 154-158 Surface Roughness 311-315 Surface Roughness 367-372 Surface Roughness 573-578 Surface Roughness 615-620 Surface Roughness 633-638 Surface Roughness 744-751 Surface Roughness 885-890 Surface Roughness 9-13 Surface Texture 177-180 Surgical Drill 779-784 Swivel Angle 101-106 Swivel Angle 47-51 Taguchi Method 165-170 Taguchi Method 381-387 Taguchi Method 539-544 Taguchi Method 911-916 Tapping Blind Hole 755-759 Temperature Field 808-813 Temperature Rise 271-275 TFT-LCD 208-213 Theory 305-310 Thermoelectric Effect 684-689 Thrust Force Directional Vibration 627-632 Ti Sheet 388-393 Ti/Tin Multilayer Film 935-939 Ti-6A1-4 353-358 Ti-6Al-4V 107-112 Ti-6Al-4V 899-904 TiAlN Coating Film 609-614 TiC Coating 970-975 Tip Radius 835-842 TiSiN Coating Film 609-614 Titanium 195-201 Titanium Alloy 88-95 Titanium Alloy 899-904 Titanium Plate 1019-1022 Tool 481-486 Tool 505-510 Tool Breakage 214-219 Tool Fabrication 481-486 Tool Life 214-219 Tool Life 347-352 Tool Life 481-486 Tool Wear 615-620 Tool Wear 773-778 Tool Wear Monitoring 719-725 Topography 148-153 Topography 690-695 Topography Characteristics 658-663 Toric Grinding Wheel 41-46 Toughened Alumina Ceramics 143-147 Toy Surface 463-468 Trabecular Bone 957-962 Trajectory Density 82-87 Transfer Coefficient 341-346 Transverse Vibration 667-671 Trap Effect 181-186 Tungsten Carbide 579-584 Tungsten Carbide Tap 755-759 Turning 202-207 Turning 760-766 Two Dimensional Ultrasonic Two-Sensor Tracing Principle 696-700 Two-Step Isothermal Glass Lens Molding 564-569 Two-Step-Dicing 263-268 Ultra-High Speed Grinding 77-81 Ultra-Precision Cutting 891-896 Ultraprecision Machining 744-751 Ultrasonic 381-387 Ultrasonic Aided Lapping 487-492 Ultrasonic Grinding 139-142 Ultrasonic Vibration Ultrasonic Vibration 143-147 Ultrasonically Ultrasonic-Magnetorheological Combined Finishing 435-440 Ultrasound 1013-1018 Uniform Design 965-969 Uniformity 447-456 UV Treatment 159-164 Velocity 559-563 Vibration 282-288 Vickers Indenter 235-240 Viscoelastic Polymer 493-498 Vitrified CBN Wheel 154-158 Volumetric Error 785-790 VRML 77-81 V-Shaped Cutting Tool 235-240 Wafer Polishing 295-304 Water-Soluble Coolant 441-446 Wear 573-578 Wear 585-590 Wear 690-695 Wear 755-759 Wear 82-87 Wear 970-975 Wear 976-980 Wear 981-986 Wear Mechanism 195-201 Wear Mechanism 653-657 Wear Mechanism 965-969 Wear Property 639-644 Wear Ratio 407-412 Wheel 879-884 Wheel Topography 119-124 White Light Interferometer 603-608 Wiener Process 976-980 Wire Sawing 177-180 Wire Sawing 70-76 Wireless Sensor 667-671 WIWNU 475-480 Work Hardening 17-22 Working Surface 1001-1006 Zinc Alloy 463-468 |
rev. 6/3/2011
© Abrasive Engineering Society 2011