EDITED by IOAN D.MARINESCU, ECKART UHLMANN, AND TOSHIRO DOI
2006 CRC Press
ISBN 11-57444-670-3
$199 plus s&h from the Abrasive Engineering Society
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The Handbook of Lapping and Polishing is the first book written in English to thoroughly cover lapping and polishing processes. Even though these processes are have a long history of applications, the literature has been largely empirical and there is little scientific research published on these important processes. Until recent scientific developments, details of applications were kept as proprietary information. In response to demands for technical information from industry, particularly the electronic industry, this book was written to show developments that transform the art of lapping and polishing into deterministic processes backed by mechanical and tribological sciences.
Chapter 2, "Fundamentals of Lapping",is an overview of the lapping process starting with the basics showing how stock removal is very different from other abrasive processes. Thoughout this book the editors have organized the latest knowledge from research in the United States, Japan, and Germany. Contributors come from both academia and industry with extensive experience in both the theoretical and practical applications. The emphasis upon chemical mechanical polishing(CMP) reflects the importance of applications in the electronics industry, which have fueled the rapid pace of both practical and theoretical knowlwege. Few people realize that advancements in computer technology rely heavily upon lapping, polishing, and chemomechanical polishing of computer components such as disk drives and computer chips. The book is an essential tool for any engineer or technician concerned with precision finishing of metal and nonmetal components.
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Professor of mechanical, industrial, and manufacturing engineering at the University of Toledo as well as director of the Precision Micro Machining Center of the College of Engineering. An author of more than 15 books and over 300 technical and scientific papers, he has given lectures and workshops in more than 40 countries around the world. Dr. Eckart Uhlmann Professor of production engineering at the Technical University of Berlin anddirector of the Institute for Machine Tools and Management, a Fraunhofer Institute. Professor Uhlmann Researcher well known in Germany and internationally for studies in abrasive processes, especially in coated abrasive processes, lapping, polishing, and grinding with lapping kinematics. Dr. Toshiro K. Doi Professor of mechanical engineering at the School of Education of Saitama University and director of the Precision Engineering Laboratory at Saitarna University. Author or coauthor of more than 170 patents, Professor Doi is a world expert in chemomechanical polishing,having published several books and over 100 papers in Japan and abroad. |
Chapter I Introduction ..................................... I loan Marinescu Chapter 2 Fundamentals of Lapping ..................................... 7 Eckart Uhlmann Chapter 3 Lapping of Ductile Materials ..................................... 93 Ioan Marinescu, Ion Benea, and Naga Jyothi Sanku Chapter 4 Lapping of Brittle Materials ..................................... 123 Ioan Marinescu, Ion Benea, and Mariana Pruteanu Chapter 5 Lapping and Lapping Machines ..................................... 265 Toshiro K. Doi and Daizo Ichikawa Chapter 6 Polishing Technology ..................................... 281 Toshiro K. Doi Chapter 7 Chemical Mechanical Polishing and Its Applications in ULSI Process ..................................... 341 Toshiro K. Doi Index ..................................... 479 |